Saturday, December 26, 2009

case study_ LUXEON Thermal Management Capabilities



LUXEON Thermal Management Capabilities


A key element in delivering quality high-power LEDs is managing the heat emitted from the LED chip. Advanced packaging technology provides LUXEON® power LEDs with unique thermal management capabilities. Using a thermal heatsink slug for the LED chip, heat is pulled away from the chip and can be transferred to a thermal management system. Because of the unique thermal design features and capabilities, LUXEON® LEDs can withstand the industry’s highest junction temperatures allowing for increased light output performance.


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